Pressemitteilungen - Food

Smart technologies on the Cologne fair grounds – Mechanical engineers become data partners

Global collaboration in packaging and processing – Anuga FoodTec Cologne, Andina Pack, PACK EXPO International, and PACK EXPO Las Vegas – Partnership expands reach, strengthening attendee and exhibitor quality

International trade fair impresses with its high international reach and strong focus on the future +++ Compact trade fair format meets content-related depth and an intensive exchange +++ Highly topical themes like AI, digitalisation and sustainable packaging solutions shape the offerings and the programme +++ Successful interlinking with the new ISM Ingredients

Interview with two experts of the jury of the renowned technology award – Applications open until May 4, 2026 at: www.foodtecaward.com

The exhibitors will provide answers to the challenges in the sweets and snacks industry at the Cologne fair grounds, with a focus on packaging design and recyclability

Interview with two experts from the jury of the renowned technology award – Registration until 4 May 2026 at: http://www.foodtecaward.com

Leading award in international food technology – Chair of the expert jury Prof Katharina Riehn on innovation trends, technological excellence and added value for award winners – Registration deadline: 04 May 2026